When it comes to process-control systems, reliability is crucial and failure can be costly or dangerous. A combination of good design practices, component selection, and testing can enhance ...

Jon Herlocker, co-founder and CEO of Tignis, sat down with Semiconductor Engineering to talk about how AI in advanced process control reduces equipment variability and corrects for process drift. What ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Robots can be programmed to coat almost any part shape, no matter how complex, at any speed needed for efficient processing. Applying a coating to a medical device or instrument can improve the device ...

Vacuum degassing processes in low carbon steel production improve material properties, with real-time gas analysis critical ...