TDK Corporation presents a new series of highly integrated, multi-channel power management modules for smartphones and tablets. TDK Corporation presents a new series of highly integrated, ...
New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.
For extra-powerful, high-efficiency inverter systems in railcars, electric power systems and more Mitsubishi Electric’s SBD-embedded SiC-MOSFET modules, including the 3.3kV/800A version released on ...
The RN171 is a small form factor, ultra-low power embedded TCP/IP module measuring only 27 x 18 x 3.1 mm. The RN171 is a full-featured 802.11 b/g surface mount module. Due to its small form factor and ...
TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...
Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...
The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
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