With a new mathematical model, a team of biophysicists has revealed fresh insights into how biological tissues are shaped by ...

Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But ...

As semiconductor manufacturers aim to produce devices at the 5-nanometer node, the ability to find tiny defects created inadvertently during the fabrication process becomes harder. In addition, there ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

A defect in a semiconductor chip may be smaller than a human hair but can create big problems in your everyday life, from crippling your car's steering to making your laptop more susceptible to ...

To further shrink electronic devices and to lower energy consumption, the semiconductor industry is interested in using 2D materials, but manufacturers need a quick and accurate method for detecting ...

Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...

A joint research team led by Dr. Hee-Eun Song of the Photovoltaics Research Department at the Korea Institute of Energy Research (President Yi Chang-Keun, hereafter “KIER”) and Prof. Ka-Hyun Kim of ...

In the steel industry, especially alloy steel, creating different defected product can impose a high cost for steel producers. One common defect in producing low carbon steel grades is Pits & Blister ...