High-bandwidth memory becomes the choke point for AI accelerators as AMD plans Seoul meetings with Samsung and Naver, while supply forecasts, HBM4 roadmaps and packaging capacity reshape pricing power ...

Samsung Electronics has signed a Memorandum of Understanding (MoU) with AMD that will see the partners collaborate on AI ...

Micron Technology is expected to beat on its fiscal second-quarter results due to a surge in demand for AI-linked hardware ...

Samsung and AMD have expanded their partnership to supply next-generation memory for AI and servers. Under the latest ...

Micron confirms AI-optimized memory and storage technologies are in production - HBM4 memory, SOCAMM2, and PCIe Gen6 SSDs - ...

Micron's stock rose on the limited supply of high-bandwidth memory and strong AI demand, which has raised expectations ahead ...

KIOXIA is developing a new type of SSD in collaboration with the NVIDIA Storage-Next initiative, and it's on track to make ...

Samsung and AMD have signed a memorandum of understanding to expand their strategic collaboration on next-generation AI memory, including cutting-edge high bandwidth memory and DDR5 chips.

The collaboration will focus on supplying Samsung’s next-generation high-bandwidth memory (HBM4) for AMD’s upcoming Instinct MI455X AI accelerators.

The stock was the sharpest riser in the S&P 500 premarket after the company said the facilities would boost its manufacturing ...

Samsung Electronics is said to be considering a shift toward multi-year contracts for memory chips, a much longer timeframe than is typical that may help stabilize supply and ease ...