Full-blown process excursions that affect every wafer are comparatively easy for fabs to detect and fix. However, “onesie-twosie,” lower-volume excursions can go unresolved for months or even years.
Automotive is demanding more emphasis on chip reliability. By 2020, electronic devices will account for over 35% of the manufacturing cost of an automobile, and by 2030, that number is expected to ...
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