Today’s highly complex and large system on chip (SoC) devices and systems present many challenges to be addressed from manufacturing tests to the field while meeting stringent requirements for test ...

System-level test (SLT), once used largely as a stopgap measure to catch issues missed by automated test equipment (ATE), has evolved into a necessary test insertion for high-performance processors, ...

New liquid-cooling enabled system delivers affordable, high-density SLT and burn-in test for high-demand, lower-volume HPC, AI, and automotive devices TOKYO, Sept. 18, 2025 (GLOBE NEWSWIRE) -- Leading ...

Heterogeneous integration and sophisticated packaging are making chips more difficult to test, necessitating more versatile and efficient testing methods to minimize the time and cost it takes for ...