Logic semiconductor manufacturers plan to replace FinFET devices with Gate All Around at sub-3nm nodes. Applied Materials has introduced a complex seven chamber system with Atomic Layer Deposition as ...
SAN JOSE, Calif., Feb. 26, 2024 (GLOBE NEWSWIRE) -- Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to ...
Speaking ahead of SEMICON Taiwan 2025, Globalwafers chairperson Doris Hsu said competition in semiconductors is shifting from process nodes and capacity to control of critical materials and ...
Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...
(Front row, from left) Dr. Daeho Kim and Dr. Jong Hwan Park of KERI have developed a groundbreaking process technology to ultrafast preparation of hard carbon, an anode material for sodium ion ...
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