Abstract: The significant negative influence of crosstalk among the diaphragms of Piezoelectric Micromachined Ultrasonic Transducers (PMUT) drives its mechanical and acoustic behavior to deviate from ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
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