Abstract: In this paper, a magneto-inductive (MI) communication link is designed to cross the air-water interface for a transmitter that is 20 meters below the surface. Simulations are used to ...
Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback