Abstract: This letter presents a 300-GHz-band power amplifier (PA) module implementing a PA integrated circuit (IC) fabricated in 250-nm indium phosphide (InP) double-heterojunction bipolar transistor ...
[1] Voß, A., “Loads Kernel User Guide,” Institut für Aeroelastik, Deutsches Zentrum für Luft- und Raumfahrt, Göttingen, Germany, Technical Report DLR-IB-AE-GO ...
Signal conditioning modules are critical components designed to convert and adapt sensor outputs into signals compatible with measurement, control, and monitoring systems. These modules perform ...
Abstract: VXI bus analog signal synthesis test module integrated a variety of testing instruments. Due to the numerous technical indicators, the complex calibration process and the cumbersome and time ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results