TDK Corporation presents a new series of highly integrated, multi-channel power management modules for smartphones and tablets. TDK Corporation presents a new series of highly integrated, ...
New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.
COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series. SAN DIEGO, CA, UNITED STATES, ...
Since GSM modems have been equipped with a GPS receiver and a micro-controller, they offer unlimited application opportunities with lower procurement costs and shorter development times. Navigation, ...
TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...
Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...
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