Abstract: This paper describes the three-dimensional structure of a single-sided cooling power module that uses a lead frame as a heat conduction path to cool power semiconductor dies on both sides.
(MENAFN- GlobeNewsWire - Nasdaq) San Francisco, CA, Jan. 12, 2026 (GLOBE NEWSWIRE) -- Java World Mag is issuing this follow-up report to provide additional factual and legal context regarding its ...
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