As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified ...

Abstract: This paper describes the three-dimensional structure of a single-sided cooling power module that uses a lead frame as a heat conduction path to cool power semiconductor dies on both sides.

Abstract: As materials and fabrication processes advance, the medium voltage (MV) silicon carbide (SiC) power semiconductors featuring exceptional electrothermal properties are emerging in high-power ...